18/11/2023
Surprise Galaxy S24 Leak Reveals Promising Next-Gen Upgrade
With a launch expected in just over two months' time, a major new Galaxy S24 Ultra leak has revealed a breakthrough technique Samsung will be using to increase the performance and efficiency of the flagship smartphone.
Daily has details on Samsung’s use of the Fan-Out Wafer Level Packaging technology that will be used in the company's next-generation silicon and that the mass production of FOWLP chips is reportedly under way. The new technology is expected to be used in the recently announced Exynos 2400 chipset—which will be used in many of the upcoming Galaxy S24 and Galaxy S24+ handsets.
