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EE Power Asia (EPA) 2025: Call for Papers EE Times Asia is seeking papers for presentation at the upcoming EE Power Asia...
21/02/2025

EE Power Asia (EPA) 2025: Call for Papers



EE Times Asia is seeking papers for presentation at the upcoming EE Power Asia (EPA) 2025, to be held virtually May 27-28, 2025.



Topics include WBG semiconductors (GaN/SiC), power converters and related technologies, motion control, power management, tools, test & measurement, and advancements in Power Electronics for the Mobility Sector.



Deadline for title and abstract submissions: March 21, 2025.



Submit proposals to Stephen Las Marias ([email protected]).



🌍 EE Power Asia (EPA) 2025 🌍



Join us for the virtual event on Powering the Future with GaN & SiC Innovation, Next-Gen Power Solutions, and Advancing Power Electronics for EVs & Beyond!



🖥️ Virtual Event

📅 Date: May 27-28, 2025



🔴 Topic 1: WBG Semiconductors

Explore the latest in Gallium Nitride (GaN) and Silicon Carbide (SiC) semiconductors and their applications in power electronics.



🔵 Topic 2: Power Conversion and Management Design Trends

Focus on emerging trends in power conversion and management design, particularly the need for improved efficiency, power quality, and new circuit topologies across various applications.



🟢 Topic 3: Power Electronics in the Mobility Sector

Look at the latest power electronics advancements in the mobility sector, particularly in electric vehicles (EVs) and their charging infrastructure.



🎯 Don't miss this opportunity to:

✅ Watch 30+ conference speeches by renowned experts

✅ Visit booths showcasing cutting-edge technologies

✅ Download technical whitepapers and resources



AMD Boosts VLMs: Unleashing Enhanced Vision & Intelligence!AMD is revolutionizing Vision-Language Models (VLMs) 🤖. Throu...
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AMD Boosts VLMs: Unleashing Enhanced Vision & Intelligence!

AMD is revolutionizing Vision-Language Models (VLMs) 🤖. Through targeted optimizations like mixed-precision training and parallel processing, VLMs can now process and merge visual and text data more proficiently. This innovation unlocks new possibilities in AI.

Discover more: https://www.eetasia.com/amd-delivers-sharper-sight-and-smarter-insight-for-vlms/?source=fpga_socialmedia

AMD strengthens these models with targeted optimizations such as mixed-precision training and parallel processing that enable VLMs to process and merge visual and text data proficiently.

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AllSurplus is selling unused IC substrate full flow process tools on behalf of an industry leader, creating world-changing technology company.

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Electronic devices see tough conditions—from automotive to aerospace to consumer and industrial environments—making silicone's unique attributes ideal.

🌟Revolutionize Robotics & Imaging with Microchip!🌟Unleash innovation in robotics and imaging with Microchip's PolarFire ...
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Unleash innovation in robotics and imaging with Microchip's PolarFire FPGA and SoC. Our solution stacks, featuring AI - enhanced 4K60 computer vision👁️‍🗨️, ROS - 2 compatibility, and wide OS support to drive efficiency. Power - efficient chips ensure cybersecurity🛡️. Ideal for medical🏥, industrial🏭, and automotive🚗 applications.

Dive in:

These new releases extend Microchip’s smart embedded vision, industrial edge, and intelligent edge communications stacks, which are already available.

Supercharge RF Signal Processing with AMD Versal™ RF SeriesElevate your RF systems to new heights with AMD's cutting-edg...
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Mark your calendars for Escom Events’ flagship event, the Semiconductor Asia Summit 2025 on next March 5th-6th, 2025 that will be held at Pavilion Hotel, Kuala Lumpur !

This summit will gather the thought leaders and leading experts from various organizations such as MIMOS Berhad, NXP Semiconductors, and AMD to explore the latest trends, challenges, and opportunities shaping the future of the semiconductor. There will be a networking session, keynotes, panel discussions, and presentations focusing on cutting-edge topics such as AI, advanced packaging, sustainability, and more.

📍Key Topics Include:
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• Advanced Semiconductor Packaging: Exploring the latest techniques and materials that are shaping the future.
• AI and Machine Learning in Manufacturing: Enhancing efficiency and precision in advanced process technologies.
• Market Outlook: Insights into semiconductor equipment forecasts, fab investments, and material market trends.
With over 200 delegates expected, this summit promises to be an unmissable event for professionals keen to stay ahead in the rapidly evolving semiconductor industry.

📎Register Now to secure your spot: https://app.escom-events.com/f/7k02elm85k02
📎Official Website : https://semiconasia.org/

We look forward to welcoming you to this landmark event!

Redefine the boundaries of innovation with AMD's groundbreaking Versal RF Series Adaptive SoCs. 🚀 Discover the first ada...
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First AMD Versal adaptive SoCs integrating high-resolution RF data converters, dedicated DSP hard IP, AI Engines, and programmable logic in a single-chip device.

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AMD Versal™ Gen 2: Accelerate Your Data, Unlock InsightsExperience the next leap in data processing with AMD Versal™ Pre...
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AMD Versal™ Gen 2: Accelerate Your Data, Unlock Insights

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Click here>>>
https://www.eetasia.com/fpga-community/?source=eetafb

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Infineon Technologies AG's Meng-Hui Ng talks about trends, challenges, and how their technologies are helping revolutionize .


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Infineon Technologies' Meng-Hui Ng talks about contactless payment trends, challenges, and how their technologies are helping revolutionize e-commerce.

Read how AMD enables flexible architecture for new levels of efficiency and scalability for in-vehicle infotainment and ...
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Read how AMD enables flexible architecture for new levels of efficiency and scalability for in-vehicle infotainment and ADAS.

In-Vehicle Experience White PaperRead how AMD enables flexible architecture for new levels of efficiency and scalability for in-vehicle infotainment and ADAS. The admin of this site has disabled the download button for this page.

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