Circuits Assembly Magazine

Circuits Assembly Magazine Circuits Assembly has more than 30 years as the clear-cut leading brand and technical publication for electronics manufacturers worldwide.

11/12/2024

On today’s episode, we’re turning our focus to a pivotal innovation that has transformed design and manufacturing processes: flexible circuits.Flexible circuits have emerged as a game-changer in the manufacturing and design of electronic assemblies. With their unique ability to bend, twist, and ...

10/30/2024

Today's podcast comes from the Surface Mount Technology Association SMTAI trade show. As the demand for smaller, faster, and more powerful devices grows, the need for innovative solutions in circuit design has never been greater. UHDI's represent a significant leap forward, allowing for more connect...

10/29/2024

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process. Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and perf...

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the re...
10/29/2024

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process.

Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and performance of your assemblies is essential.

In this episode, we break down what thermal profiling is, why it’s important, and how it affects everything from solder joint integrity to component placement.

We also explore the challenges and solutions involved in getting your thermal profile just right, ensuring your circuit assemblies are built to last in a competitive and demanding industry. And we review thermal profiling best practices, common mistakes, and the various capabilities of thermal profilers.

Our guest is Mark Waterman. Mark is the Electronics division manager at ECD, a manufacturer of thermal profiling equipment founded in 1964. He began his career at ECD in 2006.

One of the most critical aspects of manufacturing high-reliability circuit assemblies is thermal profiling during the reflow process. Whether you're designing, engineering, or troubleshooting circuit assemblies, understanding how temperatures during the reflow process influences the quality and perf...

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Read the latest issue of CIRCUITS ASSEMBLY now!

Materials Considerations for Automotive Radar Designs

Advanced safety systems require cars to react in response to external changes, leaving decisions to the vehicle, not the human occupants. An investigation of chemical process changes needed to improve radar module reliability, looking at radar designs, reliability requirements, and improvement options at the board and packaging levels.

by Lenora Clark, Paul Salerno and Senthil Kanagavel

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