SemiMedia (2025)

20/06/2024

June 20, 2024 /SemiMedia/ -- STMicroelectronics recently launched the ST4SIM-300, the industry’s first embedded SIM compliant with the upcoming GSMA eSIM IoT deployment standard. Also known as SGP.32, the new standard introduces special features to facilitate the management of IoT devices connected to cellular networks. “Leveraging the incoming GSMA specification, our embedded SIM for IoT solution, ST4SIM-300, enhances flexibility, eases network provider switching, and simplifies managing large numbers of connected devices,” said Agostino Vanore, Edge Authentication and M2M Cellular Marketing Manager at STMicroelectronics....

June 20, 2024 /SemiMedia/ — STMicroelectronics recently launched the ST4SIM-300, the industry’s first embedded SIM compliant with the upcoming GSMA eSIM IoT deployment standard. Also kno…

20/06/2024

June 20, 2024 /SemiMedia/ -- Rapidus CEO Atsuyoshi Koike recently said that the company's 2nm process test plant will start in April 2025. Rapidus's initial goal was to manufacture 2nm chips, and it has received support from Belgium's imec and the United States' IBM. Its competitor TSMC's chip fab in Kumamoto produces chips with less advanced processes. Atsuyoshi Koike said that with the support of partners, Rapidus is expected to start the world's most advanced commercial wafer foundry production only two years behind TSMC, and will further shorten the time gap in the future to gain a competitive advantage over TSMC and Samsung....

June 20, 2024 /SemiMedia/ — Rapidus CEO Atsuyoshi Koike recently said that the company’s 2nm process test plant will start in April 2025. Rapidus’s initial goal was to manufa…

20/06/2024

June 20, 2024 /SemiMedia/ -- onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic. The site would produce the company’s intelligent power semiconductors that are essential for improving the energy efficiency of applications in electric vehicles, renewable energy and AI data centers. The head of onsemi's power solutions division said the new production line could start production in 2027....

June 20, 2024 /SemiMedia/ — onsemi announced plans to establish a state-of-the-art, vertically integrated silicon carbide (SiC) manufacturing facility in the Czech Republic. The site wou…

19/06/2024

June 19, 2024 /SemiMedia/ -- GlobalWafers announced on June 18 that after the European Commission's Directorate-General for Competition approved the expansion project of GlobalWafers' Italian subsidiary MEMC Electronic Materials SpA (MEMC SpA), Ministry of Enterprises and Made in Italy also provided 103 million euros in research and development subsidies to build a 12-inch semiconductor wafer factory. Marco Sciamanna, general manager of MEMC SpA, said that the new 12-inch wafer fab will support the development of downstream products in four high-tech fields focused on by the IPCEI Microelectronics and Communication Technology (ME/CT) of the Important Program of Common Interest in Europe, including sensors, logic components, power electronics and communications components....

June 19, 2024 /SemiMedia/ — GlobalWafers announced on June 18 that after the European Commission’s Directorate-General for Competition approved the expansion project of GlobalWafer…

19/06/2024

June 19, 2024 /SemiMedia/ -- TDK Corporation has announced the expansion of its 300W rated i7C non-isolated DC-DC converter series under the TDK-Lambda brand with additional adjustable current limit models. These buck-boost board mount power modules have input ranges of 9 up to 53Vdc with output voltage adjustment from 5 to 28V, 8 to 24V or 9.6 to 48V depending upon the output current rating....

June 19, 2024 /SemiMedia/ — TDK Corporation has announced the expansion of its 300W rated i7C non-isolated DC-DC converter series under the TDK-Lambda brand with additional adjustable cu…

18/06/2024

June 18, 2024 /SemiMedia/ -- According to reports, Infineon plans to expand its R&D investment in Taiwan region and establish an Advanced Automotive and Wireless Communications Semiconductor R&D Center with a total investment of NT$1.2 billion (approximately US$37.07 million). The report pointed out that this is the first time that a European chip manufacturer has set up such a research and development center in Taiwan, symbolizing that Taiwan's influence in the global semiconductor and automotive chip fields will be further enhanced....

June 18, 2024 /SemiMedia/ — According to reports, Infineon plans to expand its R&D investment in Taiwan region and establish an Advanced Automotive and Wireless Communications Semico…

18/06/2024

June 18, 2024 /SemiMedia/ --onsemi recently released the latest generation of T10 PowerTrench® series and EliteSiC 650V MOSFET. The powerful combination can provide unparalleled efficiency and high thermal performance for data center applications in a smaller footprint. Compared to a typical search engine request, an AI-supported engine request requires more than 10x the power, leading to data center power needs expected to reach an estimated 1,000 TWh globally in less than two years....

June 18, 2024 /SemiMedia/ –onsemi recently released the latest generation of T10 PowerTrench® series and EliteSiC 650V MOSFET. The powerful combination can provide unparalleled efficiency and…

17/06/2024

June 17, 2024 /SemiMedia/ -- According to the supply chain, TSMC plans to increase its 3nm foundry price by more than 5%, and the annual quotation for advanced packaging will also increase by about 10% to 20% next year. Industry insiders said that TSMC's 3nm production capacity has been booked by four major customers including Apple and Nvidia. The production capacity is already in short supply, and it is expected that the capacity will be fully booked until 2026....

June 17, 2024 /SemiMedia/ — According to the supply chain, TSMC plans to increase its 3nm foundry price by more than 5%, and the annual quotation for advanced packaging will also increas…

17/06/2024

June 17, 2024 /SemiMedia/ -- onsemi recently released its latest 7th generation 1200V QDual3 insulated gate bipolar transistor (IGBT) power module, which provides higher power density and 10% more output power than other competitive products. Based on the latest Field Stop 7 (FS7) IGBT technology, the 800-amp (A) QDual3 module delivers industry-leading efficiency to reduce system costs and simplify designs....

June 17, 2024 /SemiMedia/ — onsemi recently released its latest 7th generation 1200V QDual3 insulated gate bipolar transistor (IGBT) power module, which provides higher power density and…

17/06/2024

June 17, 2024 /SemiMedia/ -- According to reports, in view of the market recovery, Japanese memory chip maker Kioxia stopped production cuts after 20 months and increased the operating rate of its NAND flash memory production lines at its Yokkaichi fab in Mie Prefecture and the Kitakami fab in Iwate Prefecture to 100% this month. In October 2022, Kioxia announced production cuts of more than 30% to cope with sluggish demand for smartphone products....

June 17, 2024 /SemiMedia/ — According to reports, in view of the market recovery, Japanese memory chip maker Kioxia stopped production cuts after 20 months and increased the operating ra…

14/06/2024

June 14, 2024 /SemiMedia/ -- Infineon Technologies AG announces the expansion of its next generation OptiMOS™ 7 MOSFET portfolio for automotive applications with additional 40V products in rugged lead-free packages. In addition, 80 V and 100 V OptiMOS 7 MOSFETs are now also available. The MOSFETs are optimized for all standard and future automotive 48 V applications, including electric power steering, braking systems, power switches in new zone architectures, battery management, e-fuse boxes, DC/DC, and BLDC drives in various 12 V and 48 V electrical system applications....

June 14, 2024 /SemiMedia/ — Infineon Technologies AG announces the expansion of its next generation OptiMOS™ 7 MOSFET portfolio for automotive applications with additional 40V pro…

14/06/2024

June 14, 2024 /SemiMedia/ -- According to reports, Onsemi plans to lay off about 1,000 employees worldwide in order to streamline operations and reduce costs. In addition, the company has been struggling with a slow recovery in chip demand due to a weak electric vehicle market and excess inventory among customers. onsemi said it will also consolidate nine sites and reallocate another 300 employees or ask them to relocate to another site....

June 14, 2024 /SemiMedia/ — According to reports, Onsemi plans to lay off about 1,000 employees worldwide in order to streamline operations and reduce costs. In addition, the company has…

13/06/2024

June 13, 2024 /SemiMedia/ -- According to reports, the Eindhoven City Council of the Netherlands voted on June 11 to approve the expansion plan of lithography machine manufacturer ASML, with 34 votes in favor and 6 votes against. The preliminary plan was announced by ASML and the local municipal government in April, and will develop new facilities in a relatively undeveloped area in the north of Eindhoven near the city center, which can accommodate up to 20,000 employees....

June 13, 2024 /SemiMedia/ — According to reports, the Eindhoven City Council of the Netherlands voted on June 11 to approve the expansion plan of lithography machine manufacturer ASML, w…

13/06/2024

June 13, 2024 /SemiMedia/ -- Nexperia recently announced that its class-leading 650 V, 10 A silicon carbide (SiC) Schottky diode is now automotive qualified (PSC1065H-Q) and available in real-two-pin (R2P) DPAK (TO-252-2) packaging, making it suitable for various applications in electric vehicles and other automobiles. Additionally, in a further extension to its portfolio of SiC diodes, Nexperia is now also offering industrial-grade devices with current ratings of 6 A, 16 A, and 20 A in TO-220-2, TO-247-2, and D2PAK-2 packaging to facilitate greater design flexibility....

June 13, 2024 /SemiMedia/ — Nexperia recently announced that its class-leading 650 V, 10 A silicon carbide (SiC) Schottky diode is now automotive qualified (PSC1065H-Q) and available in …

10/06/2024

June 7, 2024 /SemiMedia/ -- The global semiconductor market is expected to achieve strong growth in 2024 and 2025, according to the recent forecast released by the World Semiconductor Trade Statistics (WSTS). WSTS has raised its spring 2024 forecast, expecting the global semiconductor market to grow 16.0% over the previous year. The updated 2024 market valuation is estimated at $611 billion....

June 7, 2024 /SemiMedia/ — The global semiconductor market is expected to achieve strong growth in 2024 and 2025, according to the recent forecast released by the World Semiconducto…

31/05/2024

May 31, 2024 /SemiMedia/ -- Vishay Intertechnology, Inc. recently announced that 5 W devices in its AC and AC-AT series of cemented, axial-leaded wirewound resistors are now available with a pick and place friendly SMD lead bending option, the WSZ lead form, that allows the devices to be used as surface-mount components. Offering excellent pulse capability, the Vishay Draloric AC05 WSZ and AEC-Q200 qualified AC05-AT WSZ are also offered in a non-inductive version AC05-NI WSZ for fast switching circuits....

May 31, 2024 /SemiMedia/ — Vishay Intertechnology, Inc. recently announced that 5 W devices in its AC and AC-AT series of cemented, axial-leaded wirewound resistors are no…

28/05/2024

May 28, 2024 /SemiMedia/ -- Vishay Intertechnology, Inc. recently expanded its optoelectronic product portfolio with eight new AEC-Q102 compliant 850 nm and 940 nm high-power infrared (IR) emitters. These emitters offer best-in-class radiated intensity in a 3.4 mm x 3.4 mm surface mount package. Built on Vishay’s Astral surface emitter chip technology, the Vishay Semiconductors devices are designed for high drive currents up to 1.5 A DC and 5 A pulsed in automotive applications....

May 28, 2024 /SemiMedia/ — Vishay Intertechnology, Inc. recently expanded its optoelectronic product portfolio with eight new AEC-Q102 compliant 850 nm and 940 nm high-power infrare…

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